PDE 2007 Program and Slides
- Zip file containing Agenda and All Presentations
[~45 MB]
- Program
- Keynote:
Sustained Collaboration - The Next Generation
Tom Soderstrom
IT Chief Technology Officer
Office of the CIO
JPL
-
Why exchanging all design data to
collaborate in cross domain environments?
Hans-Ulrich Heidbrink
Mentor Graphics
Director Future Market Development Collaboration Projects
Chairman ECAD-MCAD Collaboration at ProStep
-
Collaborative Wire Harness Design in PLM Environment
Krishna Nadimetla
UGS
-
Applying Open Standards for PLM System Interoperability
William Burkett
EuroSTEP America, Inc.
-
SIMBASE:
a tri-national initiative supporting
PLCS and Synthetic Environments
Presenter:
Mark Tantillo
Jotne EPM Technology
Authors:
Dr. Tim King, LSC Group (UK),
Curzio Batini, Datamat (IT),
Kjell Bengtsson, Jotne EPM Technology (NO)
-
Simulation Data Management in PLM
Gene Allen
Director, Collaborative Development
MSC Software Corporation
-
Space System Engineering Database:
Integration and Collaboration Platform
for the Engineering Domains in the Space Industry
Presenter:
Hans-Peter de Koning
ESA/ESTEC
Authors:
Hans-Peter de Koning, ESA,
Niklas Lindman, ESA,
Harald Eisenmann, EADS Astrium,
Matthias Grau, PROSTEP
-
The Pan Galactic Status Report
(an update on the Pan Galactic Engineering Framework [PGEF])
Stephen Waterbury
NASA Goddard Space Flight Center
Greenbelt, Maryland, USA
-
Costing integrated with other model based engineering domains
using open standards across the lifecycle
Presenter:
Charlie Stirk
CostVision
Authors:
Charlie Stirk, CostVision,
Harold P. Frisch, NASA/GSFC, emeritus,
Thomas R. Thurman, Rockwell Collins,
Phil Spiby, EuroSTEP
-
The Gellish Language
a structured subset of natural languages
Dr. Ir. Andries van Renssen
Shell Global Solutions
-
Developing Taxonomies to
Enable Product Data Exchange
Cory Mickelson
JPL Enterprise Information Architecture
-
Data Exchange Standards and Ontologies for Engineering
- How to make the best use of both
Hans-Peter de Koning
ESA/ESTEC
Noordwijk
The Netherlands
-
A Language for Engineering Design
Walter W. Wilson
Lockheed Martin Enterprise Information Systems
& The University of Texas at Arlington
-
Design Refinement and Requirements Satisfaction in OWL DL
W. Henson Graves
Lockheed Martin Aeronautics Company
-
Creating Focus:
Augmented Reality for Better Standards
Matt Aronoff
National Institute of Standards and Technologies
Gaithersburg, Maryland, USA
-
Investigations into using HDF5 as
An Alternative to STEP for
Finite Element Modeling Data
Presenter:
Mike Folk
The HDF Group
Authors:
Vailin Choi and Mike Folk
The HDF Group
-
Empowering Design and
Manufacturing by Extracting
Intelligence from 3D Models
Robert Bean, PE
EVP, Kubotek USA
-
NX PCB.xchange
PCA Modeling and Exchanging Data with ECAD Systems
Mouloud Bourbel
Maya Heat Transfer Technologies Ltd.
-
An AP210-based PCA/PCB
DFx analysis tool
Presenter:
J. Stori
SFM Technology, Inc.
Authors:
A. Seth, D. Mukhopadhyay, D. Tang, P.M. Ferreira,
University of Illinois at Urbana-Champaign;
T. Thurman, Rockwell Collins, Inc.;
J. Stori, SFM Technology, Inc.
-
A Native AP210
Prototype 3-D Package Modeler
Presenter:
Anupam Seth,
University of Illinois at Urbana-Champaign
Authors:
A. Seth, D. Mukhopadhyay, P.M. Ferreira
Dept. of Mechanical Sc. & Eng.
University of Illinois at Urbana-Champaign
1206 West Green Street, MC-244, Urbana, IL, 61801, U.S.A.;
Thomas R. Thurman
Rockwell-Collins, Inc.
400 Collins Road N.E., Cedar Rapids, IA, 52498, U.S.A.;
D. Tang
Intel, Inc.
Chandler, AZ, U.S.A.;
J.A. Stori
SFM Technology, Inc.
202 W. Green Street
Urbana, IL, 61801, U.S.A.
-
The Status of STEP-TAS
(Thermal Analysis for Space)
Hans-Peter de Koning
ESA/ESTEC
Noordwijk
The Netherlands
-
IITAS Project
Industrial Implementation of STEP-TAS
Eric Lebègue
CSTB
France